Resin composition for encapsulating of semiconductor and semiconductor apparatus using of the same
US5225499A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1991 |
| Grant date | Jul 6, 1993 |
| Priority date | — |
| Expiry date | Mar 1, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition having superior molding character, bonding character, moisture resistance, and heat resistance, for encapsulating of a semiconductor which contains: PA1 (a) An ether imide group compound represented by the general formula (I) ##STR1## wherein, each of R.sup.1 -R.sup.4, R.sup.8 and R.sup.8 is hydrogen, lower alkyl group, lower alkoxy group, lower fluoroalkyl group, chlorine or bromine, and R.sup.1 -R.sup.4, R.sup.7 and R.sup.8 may be same or different each other, and each of R.sup.5 and R.sup.6 is hydrogen, methyl group, ethyl group, trifluoromethyl group or trichloromethyl group, and R.sup.5 and R.sup.6 may be same or different each other, and D is a hydrocarbon group of a dicarboxylic acid having an ethylene type unsaturated double bond of an extract of the compound obtained by extraction with water in an amount 10 times by weight of the compound at 120.degree. C. for more than 100 hours has electric conductivity of at most 300 s/cm ph of 1.5-7; and PA1 (b) an epoxy resin as well as a semiconductor apparatus encapsulated with the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.