Method of manufacturing multi-layer thin film circuits containing integrated thin film resistors
US5227012A · kind A · utility
89Cited by
3References
8Claims
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Inventors
Key dates
| Filing date | Apr 15, 1991 |
| Grant date | Jul 13, 1993 |
| Priority date | — |
| Expiry date | Apr 15, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In multi-layer thin film circuits, fabricated by alternate formation of conductor layers and insulating layers, there can be integrated thin film resistors which bear directly upon the substrate but nonetheless are not subjected, during manufacture, to the high temperatures of curing of the insulating layers and which then would be damaged. The manufacturing method also allows producing integrated electrical contacting between the thin film resistors and conductors of all of the conductor layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.