Ion-plating method and apparatus therefor
US5227203A · kind A · utility
13Cited by
0References
31Claims
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Assignee
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Key dates
| Filing date | May 19, 1992 |
| Grant date | Jul 13, 1993 |
| Priority date | — |
| Expiry date | May 19, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S118/07
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electron beam is radiated on an ion-plating material to heat and evaporate this material, thereby generating a vapor flow of the material. The vapor flow of the material is converged by a hood-like electrode, and at the same time, a positive voltage is applied to the electrode to attract thermoelectrons from the material. The vapor flow is ionized by the thermoelectrons. The converged and ionized vapor flow is deposited on a surface of a strip, thereby performing ion plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.