Polyimide film with metal salt coating resulting in improved adhesion
US5227244A · kind A · utility
13Cited by
7References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 3, 1992 |
| Grant date | Jul 13, 1993 |
| Priority date | — |
| Expiry date | Mar 3, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A polyimide film is described having improved adhesion prepared by coating the surface of a partially cured or partially dried polyamide acid film with an organic solvent solution of a metal salt and heating the coated film to both convert the polyamide acid to polyimide and dry the film. By proper selection of the metal salt either a one-side adherable or two-side adherable polyimide film can be obtained. The polyimide film can be used in electrical insulating and flexible printed circuit applications where superior adhesion is an important requirement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.