Mechanochemical polishing abrasive
US5228886A · kind A · utility
36Cited by
8References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 30, 1991 |
| Grant date | Jul 20, 1993 |
| Priority date | — |
| Expiry date | Aug 30, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A mechanochemical polishing abrasive and a process for using the mechanochemical polishing abrasive to polish the surface of a hardened workpiece cheaply and efficiently. The mechanochemical polishing abrasive comprises a slurry of colloidal silica and a mechanical abrasive selected from one or more of the materials in the group comprising Fe.sub.2 O.sub.3, Fe.sub.3 O.sub.4, MgO, BaCO.sub.3, CaCO.sub.3, MnO.sub.2, CeO, SiO.sub.2, CeO.sub.2, Cr.sub.2 O.sub.3, and Al.sub.2 O.sub.3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.