Cathode sputtering system with axial gas distribution
US5228968A · kind A · utility
17Cited by
10References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 2, 1992 |
| Grant date | Jul 20, 1993 |
| Priority date | — |
| Expiry date | Apr 2, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/34
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A gas inlet (3), a substrate holder (10) with a substrate (11) and a gas outlet (5) are located on a common axis (4) in the vacuum casing (I) of a cathode sputtering system. This results in a symmetrical flow inside the cathode station (2) and a concentric uniformity of the gas pressure. These conditions result in a particularly even coating of the substrate (11) by means of sputtering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.