Patent · US Expired

Flame-resistant cover film for flexible circuit boards

US5229192A · kind A · utility

8Cited by

4References

2Claims

0Family size

Assignee

Firma Carl Freudenberg · DE

Inventors

Horst Kober · Weinheim, DE
Thomas Kuhlmann · Jena, DE
Jorg Hausdorf · Fürth, DE
Steffen Kosack · Haßloch, DE
Werner Schafer · Essen, DE
Volker Siekermann · Fürth, DE

Key dates

Filing date	Aug 21, 1991
Grant date	Jul 20, 1993
Priority date	—
Expiry date	Aug 21, 2011

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24917
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A flame-resistant cover film for flexible circuit boards having excellent flame-resistance, handling, and storage qualities may be produced by treating an insulating film of a nonwoven polymer fabric with a flame-resistant, halogen-free polymeric adhesive. The polymeric adhesive comprises an aqueous mixture of a copolymerizate of acrylic acid esters and styrene, and an aminoplastic or phenoplastic precondensate to which a mixture of fine-particle red phosphorus and fine-particle ammonium polyphosphate is also added.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.