Composite body having a blister-free pressure-sensitive adhesive sheet attached thereto
US5229195A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1992 |
| Grant date | Jul 20, 1993 |
| Priority date | — |
| Expiry date | Jun 16, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31935
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The pressure-sensitive adhesive sheet of the invention is free from the troubles of forming blisters due to the gas emission from the substrate surface to which the adhesive sheet is applied and bonded by using a unique pressure-sensitive adhesive to form the adhesive layer on a base sheet. The principal ingredient of the pressure-sensitive adhesive used in the present invention is a copolymer having a specified molecular weight and a specified glass transition temperature and composed of (a) from 50 to 85% by weight of a first monomeric moiety of an acrylic ester, e.g., 2-ethylhexyl acrylate, (b) from 1 to 30% by weight of a second monomeric moiety of an acrylic compound having a polar group, e.g., acrylic acid, and (c) from 5 to 40% by weight of a third monomeric moiety of a macromonomer having a polymeric molecular chain of styrene units and/or methyl methacrylate units and having a polymerizable functional group, e.g., methacryloyl group, at the molecular chain end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.