Encapsulated circuitized power core alignment and lamination
US5229550A · kind A · utility
147Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1992 |
| Grant date | Jul 20, 1993 |
| Priority date | — |
| Expiry date | Mar 31, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/054
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.