Solid state memory modules and memory devices including such modules
US5229960A · kind A · utility
59Cited by
6References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 4, 1991 |
| Grant date | Jul 20, 1993 |
| Priority date | — |
| Expiry date | Dec 4, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06562
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A memory module has, on an interconnection substrate, a plurality of semi-conductor memory chips each having the same elongated shape and having output connections located at the end thereof. It has at least two chips which are mutually stacked and which are crossed so that the outputs of one chip are available beyond the periphery of the chip which is located under it in the stack. Consequently, the outputs of each chip may easily be connected to the substrate by bonded flexible wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.