Method of bonding a sputter target-backing plate assembly assemblies produced thereby
US5230459A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1992 |
| Grant date | Jul 27, 1993 |
| Priority date | — |
| Expiry date | Mar 18, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K20/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods of preparing a sputter target/backing plate assembly and assemblies so prepared are disclosed. The methods comprise forming a plurality of grooves in one of the metal surfaces to be joined in the bonding process. The grooves are each provided in a closed, loop configuration or pattern. The target and backing plate to be bonded are adjacently positioned to form an assembly with the grooved surface forming one of the interfacial joint surfaces. The assembly is then placed in a controlled atmosphere, such as a vacuum, heated to a temperature just below the melting point of the lower melting metal to be joined, and pressed until the grooves are substantially filled with metal or alloy from the other, non-grooved interfacial surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.