Patent · US Expired

Method and apparatus for thermally stable mold assembly and support

US5230728A · kind A · utility

18Cited by
5References
15Claims
0Family size

Assignee

Inventor

Key dates

Filing dateFeb 10, 1992
Grant dateJul 27, 1993
Priority date
Expiry dateFeb 10, 2012

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC03B2225/02
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A mold assembly support (10) is disclosed for providing a self-aligning thermally stable mold support in a glass sheet forming system (12) wherein a reference point within the glass sheet heating furnace (14) is connected to a geometric frame of reference outside the furnace (14). The mold assembly support (10) includes a frame (40) including mold registering members (52,54) which define a stable thermal reference point within the furnace which is maintained in an unchanging relationship with respect to the geometric frame of reference outside the furnace (14) along a glass sheet heating furnace substructure (16).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.