IC contact mechanism
US5231753A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1992 |
| Grant date | Aug 3, 1993 |
| Priority date | — |
| Expiry date | Feb 19, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In case of inserting an IC having multiple pins into an IC socket so as to be brought into contact with the IC socket, a contact pressure application unit is integrated with the IC socket, whereby the IC is inserted into and brought into contact with the IC socket without bending a lead of the IC. An IC contact mechanism comprises a contact pressure application unit having a through hole at the center thereof, the contact pressure application unit also having a mold guide portion so as to contact an outer periphery of a package of an IC and a lead presser portion for pressing a lead of the IC; and a suction block having a suction pad at the tip end thereof and movable vertically in the through hole of the contact pressure application unit characterized in that the IC is inserted into a contact socket so as to be brought into contact with the contact socket while the suction pad sucks the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.