Adhesive bonding composition with bond line limiting spacer system
US5232962A · kind A · utility
77Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1991 |
| Grant date | Aug 3, 1993 |
| Priority date | — |
| Expiry date | Oct 9, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive bonding composition with bond line limiting spacer system includes an adhesive paste composition having a hardenable adhesive component, and a plurality of spacer elements distributed in the adhesive paste composition. The spacer elements are sized to provide a self-limiting bond line thickness between the surfaces to be bonded, the bond line thickness being maintained at a selected lower limit by the spacer elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.