Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications
US5232970A · kind A · utility
61Cited by
30References
13Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 10, 1992 |
| Grant date | Aug 3, 1993 |
| Priority date | — |
| Expiry date | Jan 10, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/013
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A ceramic-filled thermally-conductive composite for use in microelectronic applications includes a substantially homogeneous mixture of a solidified polymeric material and an adamantine-structured ceramic filler, such as aluminum nitride or boron nitride, wherein the solidified polymeric material is substantially continuous. The solidified polymeric material may be a material containing a predominant amount of a fusible semi-crystalline polyamide having a melting point of greater than about 250.degree. C. or a polybenzocyclobutene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.