Laser pattern ablation of fine line circuitry masters
US5233157A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1990 |
| Grant date | Aug 3, 1993 |
| Priority date | — |
| Expiry date | Sep 11, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A fine line electrical circuit having precise rectangular conductor cross-sections (70) is electroformed on a patterned laser ablated mandrel (32,34). The mandrel comprises a stainless steel substrate (32) coated with a layer of Teflon (34). An eximer laser (44,56) is caused to project a fine spot (54) upon the Teflon (34) with a power sufficient to ablate the Teflon (34) entirely through to the stainless steel substrate (32). A software program drives the coated mandrel beneath the laser beam in an X-Y pattern that defines the pattern of a circuit to be produced, thereby exposing the conductive surface of the mandrel in the selected pattern. A pattern of conductors (70) is then plated upon the mandrel, a dielectric substrate (76) is laminated upon the mandrel and upon the pattern of conductors and then the dielectric substrate (76), together with the conductors (70) adhering thereto, is separated from the mandrel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.