Active resistor trimming by differential annealing
US5233327A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1991 |
| Grant date | Aug 3, 1993 |
| Priority date | — |
| Expiry date | Jul 1, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49082
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process of fabricating an electrical resistor and a product produced thereby in which trimming of a resistive element of a material exhibiting thermosetting properties is accomplished by in-situ annealing of one or more regions across the width of the resistive element to certain predetermined temperatures, thereby altering the crystal properties and the sheet resistance within those regions. Annealing is preferably done by laser radiation at levels below that at which any cutting or ablation of the resistive element will occur, thus avoiding defects in the resistor or associated circuits. By controlling laser radiation and the annealing process, virtually any desired trim slope may be obtained, resulting in improved trimming accuracy. Efficiency of the process is enhanced by annealing the resistive element to obtain compound trim slopes corresponding to coarse and fine trimming of the resistive element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.