Structure of semiconductor laser package
US5233622A · kind A · utility
11Cited by
2References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 20, 1992 |
| Grant date | Aug 3, 1993 |
| Priority date | — |
| Expiry date | Feb 20, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0683
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor laser package comprises a cooling structure constituted by sequentially laminating a lower substrate, a Peltier element, and an upper substrate, a heat sink having a laser element and mounted on the cooling structure, and a cap member for sealing the cooling structure and the heat sink, wherein one of the upper and lower substrate also serves as a base member of the semiconductor laser package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.