Method of producing tungsten-titanium sputter targets and targets produced thereby
US5234487A · kind A · utility
40Cited by
20References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1991 |
| Grant date | Aug 10, 1993 |
| Priority date | — |
| Expiry date | Apr 15, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3414
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Tungsten-titanium sputter targets of at least 95% theoretical density are provided with little or no .beta.(Ti, W) phase constituent. Such targets will minimize troublesome particulate emissions during sputter coating conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.