Mechanical lift-off process of a metal layer on a polymer
US5234539A · kind A · utility
3Cited by
11References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1992 |
| Grant date | Aug 10, 1993 |
| Priority date | — |
| Expiry date | Sep 14, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4076
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A lift-off process for removing a portion of a metal layer (4). The metal layer is formed on a dielectric polymer substrate with interposition of a corresponding portion of an intermediate layer (2). This process comprises the steps of selecting the material of the intermediate layer so that its interface with the metal has a low adhesivity; applying to the structure a mechanical stress causing detachment of the metal at the interface; and chemically removing the intermediate layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.