Method of surface treatment of copper foil for printed circuit boards and copper foil for printed circuit boards
US5234573A · kind A · utility
13Cited by
1References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 4, 1991 |
| Grant date | Aug 10, 1993 |
| Priority date | — |
| Expiry date | Dec 4, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of surface treatment of a copper foil for printed circuit boards comprising the steps of forming a treating layer of copper-zinc or copper-zinc-nickel by electrolysing at least a side of a copper foil in a manner of cathodic electrolysis in a bath of copper-zinc including copper ion, zinc ion, tartaric acid and alkali or further including nickel ion, and giving a chromate treatment to the copper foil. A copper foil for printed circuit boards obtained by using a copper-zinc-nickel bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.