Fireproof or refractory materials containing fire-resistant, water soluble, film-forming inorganic compounds
US5234631A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1991 |
| Grant date | Aug 10, 1993 |
| Priority date | — |
| Expiry date | Apr 30, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02W30/91
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.