Semiconductor device and process for producing the same, and lead frame used in said process
US5234866A · kind A · utility
31Cited by
8References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 3, 1992 |
| Grant date | Aug 10, 1993 |
| Priority date | — |
| Expiry date | Apr 3, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.