Device for packaging integrated circuits
US5235496A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1992 |
| Grant date | Aug 10, 1993 |
| Priority date | — |
| Expiry date | Apr 15, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4611
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The device comprises at least one printed circuit board (11,12) on which is fixed a heightening board (15) comprising at least one opening (16) for forming with the surface of the printed circuit board (12) located in facing relation to the opening, the bottom and the lateral walls of a cavity (17) for at least one integrated circuit (18) connected with the printed circuit carried by the board defining the bottom of the cavity by means of conductive wires (19). The cavity containing the integrated circuit is filled with a resin (22) completely covering the integrated circuit. The printed circuit board (11,12) is cut on its periphery along a line of through holes (23) provided with a metal coating (24) and connected to printed conductors of the board, metallized grooves (23,24) resulting from the cutting constituting connection terminals of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.