Magazine for holding disk-type workpieces in particular semiconductor wafers during wet-chemical surface treatment in liquid baths
US5236548A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1992 |
| Grant date | Aug 17, 1993 |
| Priority date | — |
| Expiry date | Jan 21, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A magazine is provided for holding disk-type workpieces, in particular seonductor wafers, in the wet-chemical surface treatment in liquid baths. The magazine is particularly useful for etching semiconductor wafers in a liquid bath, which contains an insert (5) which has a diameter of 1.1-1.9 times the diameter of the wafer (6) and which has arrangements of guide strut assemblies (12) held parallel at a spacing of at least twice the wafer thickness by spacing struts (8). The guide strut assemblies (12) comprise main guide struts (9) and subsidiary guide struts (10) which diverge at the linking points (13), which do not lie on the housing axis, in not more than three directions. This etching magazine makes possible a marked reduction in the deterioration in the wafer geometry normally observed in etching treatments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.