Process for metallizing a surface
US5236747A · kind A · utility
6Cited by
15References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1991 |
| Grant date | Aug 17, 1993 |
| Priority date | — |
| Expiry date | Jul 1, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/452
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A workpiece having a surface to be metallised is placed in an enclosure. A plasma is produced in a plasma tube which extends into the enclosure, the plasma having a post-discharge zone in which the surface to be metallised is placed. Vapour of a metal carbonyl compound is injected into the enclosure, such compound dissociating in the post-discharge plasma to cause the metal to be deposited on the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.