Photopolymerizable resin composition employing (meth)acrylonitrile in the linear copolymer to impart additional flexibility of the composition
US5236809A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1991 |
| Grant date | Aug 17, 1993 |
| Priority date | — |
| Expiry date | Jun 13, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a photopolymerizable resin composition developable with an aqueous weak alkaine solution and suitable for a printed circuit board. The photopolymerizable resin composition of the present invention is mainly composed of: PA1 (a) a linear acrylic copolymer, PA1 (b) an ethylenically unsaturated compound, and PA1 (c) a photopolymerization initiator, wherein said linear acrylic copolymer comprises as indispensable comonomers: PA1 i) at least one compound represented by the general formula: ##STR1## wherein X is a hydrogen atom or a methyl group, Y is an oxygen atom or an imino group and Z is an alkylene group having 1 to 5 carbon atoms, and PA1 ii) an ethylenically unsaturated compound having a carboxyl group. the photopolymerizable resin composition of the present invention can afford a resist film having excellent flexibility and adhesion through the use of the above-described particular linear acrylic copolymer. Therefore, when, for example, a printed circuit board is prepared by making use of the photopolymerizable resin composition of the present invention, occurrence of defectives can be remarkably reduced because no crack occurs on the resist film…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.