Laser processing apparatus
US5237151A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 18, 1991 |
| Grant date | Aug 17, 1993 |
| Priority date | — |
| Expiry date | Nov 18, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/1476
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus is disclosed for use in cutting or welding relatively thick plates. The apparatus utilizes a laser beam applied to a plate in conjunction with a jet of gas to effect the cutting or welding action, and a movable mirror system is provided in the path of the laser beam. The mirror system is controlled so that as a device for applying the laser beam to the workpiece is moved with relation to the remainder of the apparatus, the mirror system is also moved to maintain constant the travelling distance for the laser beam. Therefore, a laser light distance between the laser oscillator and a plate can be maintained at a fixed length so that a laser spot diameter on the plate is constant as the laser light heats the plate in the thickness-direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.