Surface acoustic wave device package
US5237235A · kind A · utility
59Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1991 |
| Grant date | Aug 17, 1993 |
| Priority date | — |
| Expiry date | Sep 30, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave (SAW) device package for reducing insertion loss and direct RF feedthrough of the SAW device is disclosed. The package provides for extensive shielding of each of the input and output pads. The inputs and outputs to the SAW device are separated by maintaining the inputs on one surface of the substrate and the outputs on the opposite surface of the substrate. The SAW crystal substrate including the SAW devices is bonded to the package substrate and the package is hermetically sealed via a low-temperature glass seal or solder-type sealing, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.