Multistep electronic cooler
US5237821A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1991 |
| Grant date | Aug 24, 1993 |
| Priority date | — |
| Expiry date | Nov 20, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N19/101
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A multistep electronic cooler developed for the purpose of minimizing the incoming heat quantity generated by convective heat transfer and radiant heat transfer with a simple structure and bringing the maximum achievable cooling temperature to a level lower than that in a conventional electronic cooler of this kind at a low cost. The multistep electronic cooler according to the present invention has a plurality of base plates (3) arranged as cooling plates in tiers within a vacuum container (5), a plurality of pairs of semiconductors (2) arranged between the base plates via a plurality of electrodes (4) bonded to the base plates, and one layer, at least, or more of heat shielding members (7a, 7b, 7c) covering spaces above the base plates (3). The surfaces of the parts assembled to form the multistep electronic cooler are coated with a substance having a low thermal emissivity, for example, gold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.