Method of dividing semiconductor wafer using ultraviolet sensitive tape
US5238876A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1990 |
| Grant date | Aug 24, 1993 |
| Priority date | — |
| Expiry date | Jul 19, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/222
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and an apparatus for producing semiconductor devices in which a semiconductor wafer is adhered to an ultraviolet sensitive tape, the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet sensitive tape being adhered to a ring frame so that the semiconductor wafer is fixed to the ring frame with the ultraviolet sensitive tape. Successive semiconductor wafers thus fixed to respective ring frames are subjected to a series of steps including dicing, breaking, and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided in dice and held by the ultraviolet sensitive tape with reduced adhesiveness, is sent to a next step, such as a die-bonding step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.