Microwave radiation absorbing adhesive
US5238975A · kind A · utility
16Cited by
35References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1992 |
| Grant date | Aug 24, 1993 |
| Priority date | — |
| Expiry date | Dec 14, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2896
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A microwave radiation absorbing adhesive comprises dissipative particles bound in a thermoplastic or thermosetting adhesive The absorbing adhesive may be applied directly to the surface of any object, or to an irregularly shaped object, or into cracks or crevices in or between objects, including conventional absorbers. Several types of dissipative particles and adhesives may be used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.