High modulus toughened polyamide composition
US5238990A · kind A · utility
19Cited by
8References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 1991 |
| Grant date | Aug 24, 1993 |
| Priority date | — |
| Expiry date | Jun 5, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic composition is provided which comprises a polyamide, a grafted polymer of an isomonoolefin and an alkylstyrene, such as a maleic anhydride-grafted copolymer of isobutylene and para-methylstyrene, and optionally a polyolefin polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.