Electronic package having controlled epoxy flow
US5239131A · kind A · utility
17Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1992 |
| Grant date | Aug 24, 1993 |
| Priority date | — |
| Expiry date | Jul 13, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20752
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided an electronic package assembly having a die attach paddle bonded to the package base by a compliant adhesive. A recessed channel formed in the base is partially overlapped by the die attach paddle. During package sealing, excess adhesive accumulates in the recessed channel, eliminating bridging of the adhesive to the leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.