Plasma flux spraying method of treating the surface of a substrate, for example, and apparatus for implementing the method
US5239161A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 24, 1992 |
| Grant date | Aug 24, 1993 |
| Priority date | — |
| Expiry date | Mar 24, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/34
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The invention relates to a method and to apparatus for treating the surface of a substrate, e.g. by depositing a coating thereon by plasma flux spraying, the method being of the type in which an electric arc is established inside a chamber between a cathode and an anode, in which an inert gas is injected into the chamber so that it is ionized on passing through the electric arc, thereby forming a high temperature plasma, and in which the plasma is ejected from the chamber through an ejection nozzle whose outlet orifice is in the form of a slit so as to project particles of the material for constituting the coating onto the substrate, the particles melting on contact with the plasma, thereby forming a coating on the substrate. The electric arc established between the anode and the cathode extends along an axis substantially parallel to the axis of the outlet slit of the ejection nozzle, the inert gas is injected into the chamber along a plurality of radial directions relative to the axis of the electric arc, and the material to be sprayed is carried by a carrier gas in ducts that open out for example inside the ejection nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.