Solder alloy for dental and jewelry parts

US5240172A · kind A · utility

Assignee

• Degussa AG · DE

Inventors

• Rudi Steinke · Hanau, DE
• Stefan Schittny · Alzenau, DE
• Bernd Kempf · Alzenau, DE
• Werner Groll · Alzenau, DE

Key dates

• Filing date: Jul 6, 1992
• Grant date: Aug 31, 1993
• Expiry date: Jul 6, 2012

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C22C30/00
• WIPO field: Pharmaceuticals
• WIPO sector: Chemistry

Abstract

White solder alloys for dental and jewelry parts, with working temperatures around 1000.degree. C., contain 38 to 70% by weight gold, 6 to 20% by weight palladium, 8 to 40% by weight silver, 1 to 6% by weight iron and/or cobalt, 0 to 10% by weight copper, 0-5% each by weight indium, zinc and tin, 0 to 4% each by weight gallium and germanium, ruthenium and/or rhenium. The sum of the contents of tin, zinc, indium, gallium and germanium can be between 1 and 5% by weight.