Apparatus for peeling semiconductor substrate
US5240546A · kind A · utility
32Cited by
6References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 24, 1992 |
| Grant date | Aug 31, 1993 |
| Priority date | — |
| Expiry date | Feb 24, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1983
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is disclosed an apparatus for peeling a semiconductor substrate includes an unit for fixing a reinforcing plate bonded to the semiconductor substrate, a mechanism for pushing the semiconductor substrate bonded to the reinforcing plate in a direction parallel to a bonding surface, a unit for monitoring a stress generated by the semiconductor substrate, and a controller for controlling a driving unit of the pushing mechanism of the semiconductor substrate in accordance with the monitored stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.