Patent · US Expired

Molded articles for holding wafers

US5240753A · kind A · utility

17Cited by
6References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 22, 1991
Grant dateAug 31, 1993
Priority date
Expiry dateFeb 22, 2011

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/1372
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present invention provides a molded article for holding wafers which is made of a thermoplastic resin reinforced with whiskers. The present invention provides wafer holding molded articles, such as transport baskets, storage cases and carriers, for use in handling wafers and glass plates for liquid crystal televisions. These articles are useful for cleaning, drying, transporting or storing semiconductor wafers free of contamination.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.