Process for coating or bonding electronic components and subassemblies

US5242715A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Lothar Schoen · Neunkirchen, DE
• Bernhard Stapp · Kalchreuth, DE
• Heiner Bayer · Olching, DE
• Helmut Markert · Nuremberg, DE
• Volker Muhrer · Fürth, DE

Key dates

• Filing date: Feb 14, 1992
• Grant date: Sep 7, 1993
• Expiry date: Feb 14, 2012

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/285
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In a process for coating or bonding electronic components and subassemblies with reaction resin mixtures that are stable in storage at room temperature as a one-component system for several months, reaction resin mixtures are used, which contain the following components: PA1 a cationically hardenable, solvent-free epoxy resin; PA1 a triarylsulphonium salt with hexafluorophosphate, -arsenate or -antimonate as anion, with a mass concentration of 0.01 to 5% (relative to epoxy resin); and PA1 a benzylthiolanium salt with hexafluorophosphate, -arsenate or -antimonate as anion, with a mass concentration of 0.01 to 5% (relative to epoxy resin); PA1 as well as possibly customary additives. These reaction resin mixtures are hardened through UV radiation and thermally.