Joint, a laminate, and a method of preparing a nickel-titanium alloy member surface for bonding to another layer of metal
US5242759A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 21, 1991 |
| Grant date | Sep 7, 1993 |
| Priority date | — |
| Expiry date | May 21, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12806
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A joint and a laminate including a nickel-titanium alloy such as nitinol and a method for preparing the surface of a nickel-titanium alloy member for bonding solder material and, electively, another similar or dissimilar member thereto. The method includes applying an aluminum paste flux to the titanium oxide coated surface of a nickel-titanium alloy member and heating the flux to its activation temperature. The flux removes and suspends the titanium oxide therein along with leaching titanium from the base alloy member surface to form a nickel-rich interface surface. The activated flux also coats the nickel-rich interface layer for protection from further oxidation. A bonding material such as a tin-silver solder is flowed onto the nickel-rich interface surface to displace the activated flux. Electively, another member is applied to the molten solder to form a joint between the two members. The residual flux is cleaned from the joint to prevent further deterioration of the base metal. The solder joint includes the base nickel-titanium alloy metal, the nickel-rich interface surface, and the solder material. Electively, any other member may be applied to this joint in the molten state…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.