Process for preparing semiconductor device by use of a flattening agent and diffusion
US5242858A · kind A · utility
16Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 1991 |
| Grant date | Sep 7, 1993 |
| Priority date | — |
| Expiry date | Sep 5, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/923
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for preparing a semiconductor device comprises exposing at least a part of the main surface of a semiconductor substrate, forming a layer comprising the same main component as the above substrate, forming a flattening agent layer on the surface of said layer, removing the above layer and the flattening agent layer at the same time and injecting an impurity after said removing step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.