Patent · US Expired

Flameproofed non-drip polyamide molding compounds

US5242960A · kind A · utility

8Cited by
6References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 13, 1992
Grant dateSep 7, 1993
Priority date
Expiry dateJan 13, 2012

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08K5/5313
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The invention relates to flameproofed non-drip polyamide molding compounds which contain certain quantities of PA0 a) phosphinic acid esters of polyphenols still containing free phenolic OH groups, PA0 b) zinc borate and/or zinc oxide, PA0 c) thermoplastics having a predominantly aromatic main chain, optionally PA0 d) antidripping agents (for example polyfluoroethylene polymers) and, optionally, reinforcing materials and/or mineral fillers and other additives for processing, stabilization, etc.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.