Flameproofed non-drip polyamide molding compounds
US5242960A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 1992 |
| Grant date | Sep 7, 1993 |
| Priority date | — |
| Expiry date | Jan 13, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/5313
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to flameproofed non-drip polyamide molding compounds which contain certain quantities of PA0 a) phosphinic acid esters of polyphenols still containing free phenolic OH groups, PA0 b) zinc borate and/or zinc oxide, PA0 c) thermoplastics having a predominantly aromatic main chain, optionally PA0 d) antidripping agents (for example polyfluoroethylene polymers) and, optionally, reinforcing materials and/or mineral fillers and other additives for processing, stabilization, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.