Patent · US Expired

Polyamide molding compound

US5242992A · kind A · utility

4Cited by

3References

8Claims

0Family size

Assignee

Huls Aktiengesellschaft · DE

Inventors

Gunter Poll · Marl, DE
Jurgen Finke · Marl, DE
Harald Modler · Bochum, DE
Horst Beyer · Basel, CH

Key dates

Filing date	May 26, 1992
Grant date	Sep 7, 1993
Priority date	—
Expiry date	May 26, 2012

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L77/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

1. A polyamide molding compound, comprised of: PA0 (I) an aromatic polyamide having the structure ##STR1## where n is a number between 5 and 500; X represents --SO.sub.2 -- or --CO--, and PA1 Y represents --O-- or --S--; and (II) an amorphous polyamide.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.