Printed wiring board and process for producing the same
US5243142A · kind A · utility
48Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1991 |
| Grant date | Sep 7, 1993 |
| Priority date | — |
| Expiry date | Jul 25, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0959
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board obtained by filling a non-electroconductive resin paste containing a metal powder in inner wall metallized through holes of double sided copper-clad insulating substrate, followed by curing by two steps, can mount leadless parts in high mounting density without losing a function of electroconnecting wiring layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.