Method and apparatus for measuring three-dimensional configuration of wire-shaped object in a short time
US5243406A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 1991 |
| Grant date | Sep 7, 1993 |
| Priority date | — |
| Expiry date | Jul 3, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of measuring a wire-shaped object comprises a scanning step of scanning a light beam on the surface of the wire-shaped object, a detection step of detecting a reflected light reflected from the surface of the wire-shaped object by a plurality of optical sensor cells, the optical sensor cells being mounted on an inner wall of a reflected light detection unit located over the wire-shaped object; and a measurement step of measuring a three-dimensional configuration of the wire-shaped object in accordance with output signals from the plurality of optical sensor cells, whereby, the three-dimensional configuration of the wire-shaped object is automatically measured in a short time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.