Method of mounting semiconductor elements
US5244142A · kind A · utility
9Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1991 |
| Grant date | Sep 14, 1993 |
| Priority date | — |
| Expiry date | Nov 19, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of mounting a plurality of semiconductor elements each having bump electrodes on a wiring board by pressing the semiconductor elements to the wiring board while aligning the electrodes and heating the structure. In the mounting method, one or more heat sinks are previously joined to the backs opposite to the surfaces with the bump electrodes formed thereon of the semiconductor elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.