Circuit interconnect system
US5244395A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1992 |
| Grant date | Sep 14, 1993 |
| Priority date | — |
| Expiry date | Jul 29, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10265
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A circuit interconnect system comprises a circuit pattern (22) on a rigid insulating sheet (17), forming a first circuit carrying substrate (12). A portion of the circuit pattern wraps around an edge of the insulating sheet and continues onto a vertical wall (20) of the sheet to provide a contact surface (24). An electrically conductive portion (16) of a second member (14) is mated to the first circuit carrying substrate by aligning the contact surface to the electrically conductive portion. An electrically conductive resilient material such as a conductive elastomer (35) or metal spring (35) provides electrical interconnection between the circuit pattern and the electrically conductive portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.