Electroplating of superconductor elements
US5244875A · kind A · utility
10Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1992 |
| Grant date | Sep 14, 1993 |
| Priority date | — |
| Expiry date | Jun 2, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/0324
Abstract
Processes and techniques are described for concurrent electroplating of yttrium, barium and copper from aqueous solution onto a desired substrate (e.g., nickel, nichrome or silver). Compounds of these elements are dissolved in solution and then placed in a plating cell in which the cathode is the substrate on which the elements are to be deposited. After the elements have been deposited, they are oxidized to provide the desired perovskite structure. The process may be continuous or non-continuous.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.