Apparatus for inspecting printed circuit boards with surface mounted components
US5245421A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1990 |
| Grant date | Sep 14, 1993 |
| Priority date | — |
| Expiry date | Sep 19, 2010 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/309
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for inspecting an SMT printed circuit board includes an inspection head mounted to an X-Y table, for directed movement above the SMT printed circuit board which is to be inspected. The inspection head is caused to proceed to successive viewing fields along the surface of the SMT printed circuit board, for inspection by a series of cameras disposed within the inspection head together with appropriate lighting which is selected according to the inspection which is to be performed. Prior to soldering, it is determined whether each of the series of components to be placed on the printed circuit board were deposited as scheduled, and whether the deposited components were correctly positioned. Following the soldering procedure, it is again determined whether each component remains present on the board, and in its correct position, and steps are taken to inspect the solder fillets, and to inspect for any solder bridges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.