Solder-bearing lead
US5246391A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 19, 1991 |
| Grant date | Sep 21, 1993 |
| Priority date | — |
| Expiry date | Sep 19, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/936
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A solder-bearing lead having a C-clip to resiliently grip the upper and lower surfaces of a substrate. One of the two arms forming the "C" is solder-bearing for mechanical and electrical connection to a conductive area on the substrate. In one embodiment, a polymer plug may be provided on the second arm, the plug having a narrowed neck region for improved retention by the second arm. In another embodiment, the second arm is coated with a non-conductive material, eliminating the need for mechanically retaining a plug or other insulator between the second arm and substrate. The coating on the lead is provided preferably by applying a liquid polymer to the second arm of the lead and hardening the polymer to form a durable, insulating coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.